Silicone Modified Phenolic Resin Has Good Performance And Good Effect.

As the first industrial synthetic resin, phenolic resin has a history of 100 years. Because of its readily available raw materials, convenient synthesis and resin curing properties, it can meet many requirements, so it is widely used in molding plastics, insulating materials, coatings, wood bonding and so on.

However, the reaction of phenolic resin is low, and the curing reaction releases condensed water, so that the curing process must be carried out under high temperature and high pressure conditions, which severely limits its application in the field of composite materials.

In order to overcome the inherent defects of phenolic resin, further improve the performance of phenolic resin and meet the needs of the development of new and high technology, a lot of modification studies have been carried out on phenolic resin. Good progress has been made in the use of non-metallic materials such as silicon and boron. Experts recommend that the "stone side" modified phenolic resin is effective because the names of these materials are "stone side".

Silicone resin has excellent heat resistance and moisture resistance.

The modified epoxy resin can improve the heat resistance and water resistance of phenolic resin by using silicone monomer and reaction with phenolic hydroxyl or hydroxymethyl in linear phenolic resin.

Modified phenolic resins with different properties can be obtained by modifying different silicone monomers or their mixed monomers with phenolic resin, which has wide selectivity.

The composites made of silicone modified phenolic resin can be used for 200-260 long time and can be used as instantaneous high temperature resistant materials for rocket and missile ablative materials.

The introduction of inorganic boron in the molecular structure of phenolic resin can make boron modified phenolic resin heat resistance, instantaneous high temperature resistance, ablation resistance and mechanical properties much better than ordinary phenolic resin. They are also used in aerospace technology such as rockets, missiles and space vehicles as excellent ablative materials.

The most common boron improved phenolic resin method is to produce boric acid phenyl ester by reaction of boric acid and phenol, and then react with paraformaldehyde or formaldehyde aqueous solution to form 1 boron containing phenolic resins.

The residual carbon rate of boron phenolic resin cured at 900 degrees C reached 70% and the decomposition peak temperature was as high as 625 C.

In addition, the larger -B-O- bond was introduced into the boron phenolic structure, and the toughness and mechanical properties were improved. The boron containing three direction crosslinking structure in the cured product made the ablation resistance and neutron radiation resistance better than the general phenolic resin.

The bending strength of the carbon cloth boron phenolic laminate is 420MPa, the shear strength is as high as 39.7MPa, and the ablation rate of oxygen acetylene is only 0.0364g/s, which is 20% lower than that of carbon / barium phenolic resin.

The water resistance of bisphenol A boron phenolic resin synthesized by formaldehyde aqueous solution has been further improved.

In the 70s of last century, Beijing glass steel compound material Co., Ltd. (Beijing 251 factory) successfully developed boron phenolic resin together with Hebei University, and has achieved mass production in recent years.